SGS Certificate: TSNEC1000280801/CHEM Technical papers: For bonding wire technical paper, you can reference to ASTM files as following. ASTM F487 “Standard Specification for Fine Aluminum 1% Silicon Wire for Semiconductor Lead Bonding”. ASTM F584 “Standard Practice for Visual Inspection of Semiconductor Lead Bonding Wire”. ASTM F76-02 “Standard Specification for
Fine Gold Wire of
Bonders: ASM machine Eagle60,iHawk,AB530, AB559A, www.asmpacific.com KNS copper ball bonder type Maxum plus,Nu-Tek, www.kns.com ESEC major wire bonder 3200,3100sc : www.esec.com Wedges: Gaiser Tool www.gaisertool.com SPT www.smallprecisiontools.com Suggest KNS CuPRA series for copper wire ball bonding General Wedges: 2130-2025-L,2130-2020-L(1.0mil wire) We have offices or agent in most major cities of China such as: Guangzhou.Shenzhen.Dongguan.Fuzhou.Putian.Hangzhou.Shanghai. Technical problems can contact our local engineers for convenience. Background Knowledge: Cu-Au Bonding compare |
